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Deposition process with high aspect ratio

Powder atomic layer deposition equipment
FB-ALD
Consultation Customization
Product Showcase Equipment Introduction Product Advantages

Powder atomic layer deposition equipment FB-ALD

FB-ALD is jointly developed with the national special team and is based on a new deposition method developed on the basis of Chemical Vapor Deposition (CVD), where the deposit is deposited on the surface of the substrate in the form of a single layer of atoms. Because FB-ALD can realize uniform deposition with atomic-level precision, it is especially suitable for deposition processes with high depth-to-width ratios.FB-ALD technology has been commonly used in advanced manufacturing industries such as semiconductors and photovoltaics, but the traditional FB-ALD process is only applicable to the deposition process of sheet materials.

Technical Advantages

High precision of deposition process

FB-ALD deposition is single-atom deposition, and the deposition is self-limiting, and the deposition accuracy is up to 1A (0.1nm), which is much higher than the deposition accuracy of ordinary CVD.

Meets high aspect ratio materials

For materials with irregular surfaces, the traditional CVD process is prone to produce “voids”, resulting in uneven deposition; FB-ALD deposition layer is a single-atom layer, which can uniformly cover the surface layer of materials with high Depth-Width Ratio (D/W).

Adjustable thickness of the deposited layer

FB-ALD layer thickness can be adjusted arbitrarily by the number of atomically deposited layers, which is highly controllable.

Ultra-homogeneous coating of powder materials

With the uniquely designed Fluidized Bed, the powder material forms a fluidized state in the reactor and reacts fully with the deposited gas to achieve ultra-homogeneous coating with high isotropy.

Large variety of sedimentary material

Currently depositable chemicals include substances such as alumina, silicon dioxide, chine dioxide, silicon carbide, etc.

Low reaction temperature

The deposition temperature of the FB-ALD process is usually lower than 300°C, which can be applied to heat-sensitive materials or materials that are not resistant to high temperatures (e.g., high-nickel ternary cathode materials).

High purity sediments

FB-ALD process deposition switches between medium-high vacuum (<1 Torr) and high-purity deposition gas and carrier gas without impurity introduction

High degree of automation control

The equipment is controlled by PLC programming, combined with high-precision automatic feeding system and detection system to realize a high degree of automation and reduce operator error.