I. Fluidized bed vapor deposition reactor (FB-CVD)

Model:FBCVD-20 3kg experimental equipment, FBCVD-100 20kg pilot-level equipment, FBCVD-500 100kg mass-production-level equipment.

Feature Description:The porous powder is placed on the bottom of the cone or cylinder to form a porous granular solid layer, vacuum is drawn out, and then the gas is used to pass through the porous granular solid layer to make it become a suspension movement state, with the increase of the gas flow rate, the granular solid layer moves violently the void increases, and attached to the porous tiny particles of solids, and then stops joining the gas, and the deposition is formed, and then repeat the reaction through the other gases to get the porous-like products.

Types of carrier or reaction gases used: H2, O2, N2, Ar, CH4, C2H2, etc.

Types of powder materials: porous carbon, carbon nanotubes, catalysts, ceramic materials, precious metal powders, pharmaceutical particles or powders, graphite, silicon and metal oxides, etc.

Material size requirement: ≥1μm

Advantages: ①High heat and mass transfer coefficient, more than one order of magnitude higher than the traditional fixed bed and moving bed. ② Reaction zone temperature uniformity, strong thermal effect reaction diffusion and heat supplementation has a very obvious advantage. ③Temperature control uniformity than fixed bed in the temperature control reaction temperature accuracy is irreplaceable. ④ The unit capacity is large, energy efficiency and full contact, production capacity is much larger than the fixed bed reactor. ⑤ Reaction area mass are in the flow of dynamic, the material is easy to add and unload, effectively reduce energy consumption and improve production efficiency. ⑥ The equipment is automated and controlled, close to commercialized equipment, providing performance stability. ⑦Equipment integrated design, to meet the explosion-proof demand.

II. Fluidized Bed Spray Nano-coating (FB-SDNC)

Function: The soluble coating material is dissolved and then sprayed with a spray for liquid phase spraying, and the material which is in a completely fluidized state in the carrier gas is coated and deposited to obtain a solid form. The two technologies are integrated with each other to improve the coating ability of industrialized materials and also to achieve the purpose of modification.

Types of carrier or reaction gases used: N2, Ar, air, etc.

Material size requirement: ≥1μm.

Operating temperature of reaction system: ≤150℃.

Spray operating temperature: ＜300℃.

Types of powder materials: graphite, metal oxides, metal powders and ceramic powder materials, etc.

Advantages: ① fluidized bed plus finer droplet coating more uniform. ② The choice of coating material is more extensive. ③Continuous production can be realized, and the capacity is larger than the traditional fixed-bed reactor. ④Automatic control of the equipment reduces the requirement of manual operation and improves the stability of quality.

III. Powder Atomic Layer Deposition (PALD) Equipment

Function: Powder is deposited on the surface of the substrate with a single layer of atomic deposits to carry out chemical adsorption and reaction.ALD can realize uniform deposition with atomic level precision, which is especially suitable for the deposition process with high depth-to-width ratio, so the ALD technology has a wider applicability than the traditional ALD, which is only used for the deposition process of the sheet, and cannot be applied to the semiconductors and photovoltaic and other advanced manufacturing industries.

Advantages: ①Deposition process accuracy is much higher than the deposition accuracy of ordinary CVD, which can reach 0.1nm, with self-limiting. ②The deposition thickness can be adjusted arbitrarily by the number of atomic deposition layers, which is highly controllable. ③Satisfy high depth-to-width ratio materials, can be for the surface of irregular materials, and ALD deposition layer for a single atomic layer is more uniform than the traditional CVD process deposition. ④ It is possible to use the uniquely designed fluidized bed to let the powder material form a fluidized body in the reactor, which fully reacts with the deposition gas to achieve ultra-homogeneous encapsulation with a high degree of isotropy. ⑤There are many kinds of deposited materials, and currently there are chemicals such as alumina (AL203), silicon dioxide (SIO₂), Chin dioxide (TiO2), silicon carbide (SiC) and so on that can be deposited. ⑥ Low reaction temperature, the deposition temperature of ALD process is usually lower than 300℃, which can be applied to heat-sensitive materials or materials that are not resistant to high temperature (such as high-nickel ternary cathode materials). ⑦ very high purity deposits, ALD process deposition in a medium-high vacuum (<1Torr) and high purity deposition gas and carrier gas switching between each other, no impurities introduced. ⑧Automatic control, through PLC programming control, combined with automatic feeding system and detection system, to achieve a high degree of automation, reducing operator error.

IV. Cooperation and customization of carbon nanotube-related equipment

The company has also laid out the equipment for the two core technology directions of carbon nanotubes: catalyst synthesis and CVD vapor deposition, and assisted in the construction of CNT powder R&D and production equipment.

The company has rich experience in CVD vapor deposition of carbon nanotubes, and is one of the few companies in China that can customize the design according to the layout of the customer's site.

The company has also supplied carbon nanotube production lines and experimental R&D equipment to many domestic enterprises.